应变硬化速率
Numerical analysis indicates that strain hardening and strain rate hardening are to resist the growth of voids, whereas the ambient temperature is to promote the growth of voids in OFHC. It is also shown that the thermal softening has negligible influence on the growth of voids.
模型的数值分析表明,对OFHC铜来说,应变硬化效应、应变率效应阻碍了孔洞的增长,热效应对孔洞增长影响不大,而环境温度的升高促进了孔洞的增长。
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